研究目的
To study the effect of an applied electric field on the fracture toughness of polarized GaN piezoelectric semiconductor ceramics.
研究成果
Fracture toughness of GaN piezoelectric semiconductor ceramics increases by 22% under an electric field of 0.83 kV cm?1 and then stabilizes, due to carrier redistribution and induced electric fields, differing from traditional piezoelectric ceramics. This finding aids in understanding PSC fracture behavior and informs reliability design for electronic devices.
研究不足
The study is limited to GaN ceramics and specific experimental conditions; results may not generalize to other materials or higher electric fields. The numerical model assumes certain material properties and boundary conditions that might not capture all real-world complexities.
1：Experimental Design and Method Selection:
The study used experimental and numerical methods, including the single edge pre-cracked beam method for fracture testing under electric field loading, and finite element analysis using COMSOL software to simulate stress, electric field, and carrier distribution.
2：Sample Selection and Data Sources:
GaN ceramics were made from GaN powder via vacuum hot pressing. Samples were polarized and pre-cracked three-point bending specimens with specific dimensions were manufactured.
3：List of Experimental Equipment and Materials:
Equipment includes a specific saw with a 0.06 mm-thick blade (diamond and bronze), PTFE slices, silver paste for electrodes, DC high voltage source, displacement control loading system with corundum ceramics supports and indenter, silicone for insulation, and a 3-D optical profiler (Bruker, NPFLEX). Materials include GaN powder, β-Ga2O3, NH3 gas, and silicone.
4：06 mm-thick blade (diamond and bronze), PTFE slices, silver paste for electrodes, DC high voltage source, displacement control loading system with corundum ceramics supports and indenter, silicone for insulation, and a 3-D optical profiler (Bruker, NPFLEX). Materials include GaN powder, β-Ga2O3, NH3 gas, and silicone. Experimental Procedures and Operational Workflow:
4. Experimental Procedures and Operational Workflow: Specimens were polarized, pre-cracked, and tested under combined electrical and mechanical loads in silicone to prevent discharge. Mechanical load was applied at 0.05 mm/min until fracture, with electric field applied via electrodes. Ten specimens were tested per condition.
5：05 mm/min until fracture, with electric field applied via electrodes. Ten specimens were tested per condition. Data Analysis Methods:
5. Data Analysis Methods: Fracture toughness was calculated using the stress intensity factor formula from critical load measurements. Finite element analysis used COMSOL to solve governing equations for stress, electric field, and carrier distribution.
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3-D optical profiler
NPFLEX
Bruker
Measured fractography and profile roughness.
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saw
0.06 mm-thick blade
diamond and bronze
Used to cut pre-cracks on the samples.
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PTFE slices
Fixed on the ends of samples to act as insulating layers for electrodes.
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silver paste
Plated on PTFE slices to act as electrodes.
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DC high voltage source
Applied electric field to the electrodes.
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loading system
Applied mechanical load to the specimens.
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silicone
Used to prevent discharge during electromechanical loadings.
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COMSOL
COMSOL
Used for finite element analysis to calculate stress field, electric field, and carrier distribution.
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