1：Experimental Design and Method Selection:

The study involves designing and fabricating a silicon photonic transmitter with dual parallel MEMZMs, using a series push-pull configuration to reduce microwave losses and improve bandwidth. The methodology includes DC and small-signal characterization, large-signal modulation tests, and BER performance evaluation under various conditions.

2：Sample Selection and Data Sources:

The transmitter was fabricated on a silicon-on-insulator wafer using a multi-project wafer run at the Institute of Microelectronics (IME A*STAR). Experimental data were collected through measurements of insertion loss, phase shift, S-parameters, and BER.

3：List of Experimental Equipment and Materials:

Key equipment includes a Keysight lightwave component analyzer (LCA), GSSG probes, digital to analog converter (DAC), RF amplifiers, tunable delay lines, praseodymium-doped fiber amplifier (PDFA), photodetector (PD), real-time oscilloscope (RTO), and single-mode fiber (SMF-28e+). Materials involve silicon photonic chips, aluminum metal layers, and on-chip terminations.

4：Experimental Procedures and Operational Workflow:

The setup involved coupling a continuous wave laser into the chip, generating binary signals with a DAC, amplifying them with RF amplifiers, applying delays, modulating the optical signal, transmitting over SMF, amplifying with a PDFA, detecting with a PD, and sampling with an RTO for offline processing including equalization and BER calculation.

5：Data Analysis Methods:

Data analysis included resampling, feedforward equalization (FFE), symbol de-mapping, and bit error counting using offline processing on the sampled data to evaluate BER performance.