研究目的
To fabricate nano-structured V-shaped grooves on black-silicon (B-Si) to improve optical emissivity for on-board spaceborne blackbody systems, enabling precise calibration of image sensors in space missions.
研究成果
The nano-structured V-shaped grooves on B-Si were successfully fabricated using DRIE, achieving high aspect ratios and near-zero reflectance in UV-to-near IR wavelengths, making it suitable for on-board spaceborne blackbody systems. Future work should focus on improving performance in longer wavelengths.
研究不足
The reflectance of the fabricated B-Si increases sharply for wavelengths above 1 μm, limiting its use to UV-to-near IR range; further work is needed to extend the wavelength range for mid-IR applications.
1：Experimental Design and Method Selection:
The study used deep reactive ion etching (DRIE) to create V-shaped grooves on B-Si wafers, with SEM and IR spectroscopy for characterization. The design aimed to enhance emissivity for blackbody applications.
2：Sample Selection and Data Sources:
Bare silicon wafers were used as the substrate for fabrication. Data on morphology and reflectance were collected from the fabricated samples.
3：List of Experimental Equipment and Materials:
Equipment included a cryogenic DRIE etcher (AMS 200 model), SEM (Field Emission-SEM Sirion, FEI), spectrophotometer (Perkin Elmer LAMBDA 1050 UV/Vis/NIR with integrating sphere), and gases like SF6 and O2. Materials included silicon wafers.
4：Materials included silicon wafers.
Experimental Procedures and Operational Workflow:
4. Experimental Procedures and Operational Workflow: The DRIE process was performed with specific parameters (SF6 40 sccm, O2 18 sccm, RF power 1000 W, pressure 10 mTorr, temperature -110°C, etching time 15 min). After fabrication, SEM was used for morphological analysis, and spectrophotometry for reflectance measurements.
5：Data Analysis Methods:
Morphological data (height, diameter, aspect ratio) were analyzed from SEM images, and reflectance spectra were measured and interpreted to assess emissivity.
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