研究目的
To study the influences of processing parameters, particularly defocusing amount (DA) and molten pool boundaries (MPBs), on the densification, microstructure, tensile properties, and hardness of selective laser melted AlSi10Mg alloy.
研究成果
The research demonstrated that defocusing amount (DA) significantly affects densification, microstructure, and mechanical properties of SLMed AlSi10Mg. Optimal DA of 0.5 mm yielded high tensile strength (456 MPa) and ductility (9.5%). MPBs influence fracture behavior, with appropriate DA promoting ductile deformation. Future studies could explore wider parameter ranges and other alloys.
研究不足
The study is limited to AlSi10Mg alloy and specific SLM parameters; results may not generalize to other materials or processes. The DA range was from -2 to 2 mm, and further optimization or broader ranges could be explored. Micro-CT resolution was ~2 μm, which might not capture all defects.
1:Experimental Design and Method Selection:
The study systematically varied volumetric energy density (ε) and defocusing amount (DA) to investigate their effects on AlSi10Mg alloy fabricated by selective laser melting (SLM). The methodology included optimizing SLM parameters to achieve high density and analyzing microstructure and mechanical properties.
2:Sample Selection and Data Sources:
Commercial AlSi10Mg powder with specific chemical composition and particle size range (20–60 μm) was used. Sixty cylindrical and tensile samples were produced with varying laser power and DA values.
3:List of Experimental Equipment and Materials:
Equipment included a Concept Laser M2 SLM machine, laser diffraction particle analyzer (Coulter LS230), SEM (Quanta 200, Zeiss Axioscop 40 Pol), EDX spectroscope, XRD (D8 Advanced), micro-CT system (diondo d2), EBSD system (ZEISS Merlin), tensile testing machine (Instron), and Vickers hardness tester (FV-700). Materials included AlSi10Mg powder and etching solutions.
4:0). Materials included AlSi10Mg powder and etching solutions. Experimental Procedures and Operational Workflow:
4. Experimental Procedures and Operational Workflow: SLM processing was conducted with constant layer thickness (30 μm) and hatch spacing (100 μm). Laser power and DA were varied. Samples were polished, etched, and analyzed using microscopy, spectroscopy, diffraction, tomography, and mechanical testing.
5:Data Analysis Methods:
Data were analyzed using statistical methods for density, mechanical properties, and microstructure characterization. Software tools for image analysis and data processing were implied but not specified.
独家科研数据包,助您复现前沿成果,加速创新突破
获取完整内容-
Zeiss Axioscop 40 Pol
Axioscop 40 Pol
Zeiss
Polarising microscope for macro- and microstructural analysis.
-
Quanta 200
Quanta 200
FEI Company
Scanning electron microscope for microstructural analysis.
-
ZEISS Merlin
Merlin
ZEISS
SEM with EBSD system for crystallographic orientation analysis.
-
Concept Laser M2
M2
Concept Laser GmbH
Selective laser melting machine used for fabricating AlSi10Mg samples.
-
Coulter LS230
LS230
Coulter
Laser diffraction particle analyzer used to measure powder size distribution.
-
EDX spectroscope
EDAX Inc.
Energy dispersive X-ray spectroscope for chemical composition analysis.
-
D8 Advanced
D8 Advanced
Bruker AXS GmbH
X-ray diffractometer for phase identification.
-
diondo d2
d2
diondo
Microfocus CT detection system for porosity analysis.
-
Instron
25 mm dynamic extensometer
Instron
Tensile testing machine for mechanical properties evaluation.
-
FV-700
FV-700
FUTURE-TECH
Vickers hardness tester for microhardness measurements.
-
登录查看剩余8件设备及参数对照表
查看全部