研究目的
To improve the electrical conductivity of nitrogen-doped hydrogenated amorphous carbon films (a-C:H:N) by varying deposition parameters such as total pressure, substrate temperature, and nitrogen partial pressure.
研究成果
The study successfully deposited a-C:H:N films with low electrical resistivity (about 1 Ohm cm) by optimizing deposition parameters. Key findings include decreased deposition rate and hardness with increased nitrogen flow, and a confirmed correlation between density and hardness. The high conductivity is attributed to higher substrate temperatures and nitrogen content. Industrial applications require careful parameter selection due to trade-offs in deposition rate and hardness.
研究不足
Only one sample series (pt = 0.02 Pa, TS = 300 °C) provided reliable ERDA data due to element losses and scatter in other series. Film thickness variations and adhesion issues affected hardness measurements, with some breaches of the Bückle rule. Kinetic energies of ionic species at high pressures were estimated, not measured. Further characterization (e.g., OES) is needed for complete understanding.
1：Experimental Design and Method Selection:
The study used a plasma-activated chemical vapor deposition (PACVD) technique with a plasma beam source (PBS) to deposit a-C:H:N films. Parameters varied include total pressure (
2：02 to 1 Pa), substrate temperature (100 °C and 300 °C), and nitrogen flow ratio (fr = q(N2)/q(C2H2) from 0 to Sample Selection and Data Sources:
Films were deposited on glass slides and doped silicon wafers, cleaned in acetone and ethanol.
3：List of Experimental Equipment and Materials:
Equipment includes a PBS 200 plasma beam source, BORALECTRIC resistance heater, Aera mass flow controllers, Mahr Perthometer Concept profilometer, ERDA setup with 43 MeV 35Cl7+ ion beam, Bruker AXS D8 Discover diffractometer for XRR, Fischerscope H100 XYp for microhardness, and a linear four-point probe for electrical resistance. Materials include acetylene (C2H2) and nitrogen (N2) gases.
4：Experimental Procedures and Operational Workflow:
Substrates were cleaned, mounted, and subjected to in-situ plasma cleaning. Films were deposited at specified pressures, temperatures, and flow ratios, with deposition times adjusted based on conditions. Thickness, elemental composition, density, hardness, and electrical resistance were measured post-deposition.
5：Data Analysis Methods:
ERDA data analyzed using NDF v9.6i software, XRR data fitted for density, hardness averaged from multiple indentations, and electrical resistance calculated from sheet resistance and thickness.
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