研究目的
To develop a fast and highly responsive infrared photodetector using n-type SnSe2 thin film on p-Si substrate by exploiting the mobility of the counter semiconductor to control response times and enhance optoelectronic properties.
研究成果
The n-SnSe2/p-Si photodiode exhibits a rectification ratio of ~147 at ±5 V, responsivity of 0.12 A/W at 5 V, and fast response/recovery times of ~57±25/34±15 μs. The enhanced performance is attributed to optimal band gap, efficient charge carrier separation, and high mobility of p-Si. This approach enables integration with Si technology for fast infrared photodetectors and can be extended to other wavelengths.
研究不足
The device has a polyscrystalline nature with possible defect states leading to charge recombinations, which may slow down response/recovery rates compared to single-crystalline devices. The built-in potential is low (~0.03 eV), and the depletion layer is thin, contributing to leakage current. The response times are limited by instrument capabilities in some measurements.
1:Experimental Design and Method Selection:
The study involves fabricating a photodiode using n-SnSe2 on p-Si substrate to exploit the high mobility of p-Si for improved response times. Theoretical models for transit time in photodiodes and photoconductors are used.
2:Sample Selection and Data Sources:
p-Si (100) substrate with resistivity ~2 Ωcm (carrier concentration ~7×10^15 cm^-3) from Sigma Aldrich is used. SnSe2 thin films are grown via DC sputtering and selenization.
3:List of Experimental Equipment and Materials:
Equipment includes DC magnetron sputtering system, selenization chamber, X-ray diffractometer (X'pert-PRO PANAlytical), SEM (Ultra55 FE-SEM Karl Zeiss EDS), AFM (A.P.E. Research A100-AFM), surface profilometer (Veeco Dektak 6M), UV-Vis-NIR spectrophotometer (Perkin Elmer-lambda 750), Raman spectrometer (Visible LabRAM HR), XPS (Axis Ultra DLD from Kratos), thermal evaporation system for Cr/Au electrodes, Keithley SMU2400 source meter, 1064 nm laser, mechanical optical chopper, digital storage oscilloscope. Materials include Sn metal target, hydrofluoric acid, deionized water, Ar gas, Cr and Au for electrodes.
4:Experimental Procedures and Operational Workflow:
p-Si substrate is etched in HF, sonicated, and purged with N
5:Sn is sputtered at 43 W for 20 min, followed by selenization at 450°C for 1 h in Ar. Film characterization includes XRD, SEM, AFM, thickness measurement, DRS, Raman, XPS. Devices are fabricated with Cr/Au electrodes. Photodetection is performed under 1064 nm laser, with I-V and I-t measurements. High-speed measurements use an optical chopper and oscilloscope. Data Analysis Methods:
Data analyzed using Cheung's method for diode parameters, power law for photocurrent dependence, exponential fitting for response times, and equations for sensitivity, responsivity, EQE, detectivity.
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X-ray diffractometer
X'pert-PRO
PANAlytical
Characterizing the crystal structure of the SnSe2 thin film
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Scanning electron microscope
Ultra55 FE-SEM
Karl Zeiss
Determining surface morphology and roughness of the film
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Surface profilometer
Dektak 6M
Veeco
Measuring the thickness of the film
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UV-Vis-NIR spectrophotometer
lambda 750
Perkin Elmer
Obtaining diffuse reflection spectrum and absorbance
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X-ray photoelectron spectroscopy system
Axis Ultra DLD
Kratos
High-resolution XPS measurements
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Source meter
SMU2400
Keithley
Measuring current-voltage characteristics
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Atomic force microscope
A100-AFM
A.P.E. Research
Measuring surface roughness in non-contact mode
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Raman spectrometer
LabRAM HR
Visible
Performing Raman study of the film
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Laser
Illuminating the film for photodetection
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Optical chopper
Creating optical pulses for high-speed measurements
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Digital storage oscilloscope
Recording time-dependent response
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