研究目的
To develop a low-cost and highly-integrative D-band OOK transceiver chipset in 65-nm bulk CMOS technology for short-distance wireless connectivity, overcoming limitations such as low transistor fmax and inaccurate modeling at mm-wave frequencies.
研究成果
The D-band OOK transceiver implemented in 65-nm bulk CMOS technology demonstrates decent performance with low DC power consumption and small chip area, offering a cost-effective solution for short-distance wireless connectivity. The proposed architecture and modeling techniques effectively overcome the limitations of the low-speed technology, enabling data transmission up to 10 Gbps.
研究不足
The supplementary transistor modeling is extrapolated from measurements up to 50 GHz to D-band frequencies, which may not be fully accurate. The transceiver is designed for short-distance communication (up to 0.03 m) with relatively low output power, limiting its range. Data rates are constrained by the oscilloscope bandwidth in some tests.
1：Experimental Design and Method Selection:
The study involves designing and fabricating a D-band OOK transceiver using a 65-nm bulk CMOS process. Supplementary empirical transistor modeling is performed to improve accuracy at mm-wave frequencies. The transmitter uses a frequency-multiplier-based architecture without a power amplifier, and the receiver uses a non-coherent architecture with a DC-coupled amplifier and envelope detector.
2：Sample Selection and Data Sources:
Transistors of various sizes are used for modeling, and the transceiver chips are fabricated and tested.
3：List of Experimental Equipment and Materials:
Includes CMOS fabrication tools, RF probes, oscilloscopes, arbitrary waveform generators, sub-harmonic mixers, D-band horn antennas, and on-chip components like transmission lines and baluns.
4：Experimental Procedures and Operational Workflow:
Steps include transistor modeling, circuit block design (oscillator, amplifier, doubler, modulator, pre-amplifier, detector), integration into transceiver chips, measurement of output power, responsivity, NEP, and data transmission tests using on-chip loopback and air-channel setups.
5：Data Analysis Methods:
Performance metrics such as output power, gain, responsivity, NEP, and eye diagrams are analyzed; simulations are compared with measurements to validate the model.
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