研究目的
To exploit the anisotropy of single crystalline silicon to enable side-supported radial-mode thin-film piezoelectric-on-silicon disc resonators with minimized anchor loss, and to study the effect of material properties and tether location on anchor loss through simulation and experimental validation.
研究成果
Side-supported radial-mode TPoS disc resonators on SCS with tethers aligned to [100] plane achieve significantly reduced anchor loss and high quality factors for high-order harmonics, making them suitable for VHF oscillators. Experimental results confirm simulations, showing up to 11,500 unloaded Q at 196 MHz. This approach outperforms isotropic materials and misaligned tethers, with TCF data aiding mode identification.
研究不足
The study is limited to VHF band frequencies (up to 200 MHz), and the electrode design is not optimized for coupling factor, potentially affecting performance. Simulations assume specific material properties and neglect contributions from AlN and Molybdenum layers in TCF modeling. Fabrication complexities and material dependencies may constrain scalability.
1:Experimental Design and Method Selection:
The study uses finite element modeling with COMSOL to simulate anchor loss using a 3D perfectly matched layer (PML) approach. Experimental validation involves fabricating and testing TPoS disc resonators on SCS and UNCD substrates.
2:Sample Selection and Data Sources:
Resonators are fabricated on 8μm SOI wafers for SCS and UNCD films. Measurements are taken using a network analyzer and probes.
3:List of Experimental Equipment and Materials:
Equipment includes COMSOL software, Rohde & Schwarz ZNB 8 network analyzer, Cascade Microtech GSG probes, SOI wafers, sputtered Molybdenum and AlN layers, UNCD films, etching tools (e.g., ICP etcher), and a Janis cryogenic vacuum probe station. Materials include single crystalline silicon, ultra-nano-crystalline diamond, AlN, Molybdenum, and doped silicon substrates.
4:Experimental Procedures and Operational Workflow:
Fabrication involves sputtering metal and piezoelectric layers, etching to define structures, backside etching, and release. Measurements are conducted in atmospheric pressure and partial vacuum, with frequency response and TCF analyzed.
5:Data Analysis Methods:
Quality factors are extracted from S21 measurements, anchor loss is simulated in COMSOL, and TCF is modeled and compared with experimental data.
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