研究目的
To critically address the performance of optical interconnects using an equivalent electrical model with different composite materials, focusing on reducing propagation delay, power dissipation, and power delay product at advanced technology nodes.
研究成果
The MLGNR-based optical interconnect shows superior performance with a 99.91% improvement in propagation delay and a 59.73% reduction in power delay product compared to other composite materials at the 22 nm technology node, making it a promising candidate for future nanoscale technologies.
研究不足
The study focuses on electrical modeling and simulation without physical fabrication or experimental validation. It assumes specific parameters (e.g., fraction of electron scattered specularly as 0.6) and may not account for all real-world variations or manufacturing challenges.
1：Experimental Design and Method Selection:
The study uses an equivalent electrical model for optical interconnects, including modeling of composite materials and multi-layered graphene nanoribbon (MLGNR). Industry standard HSPICE is employed for simulation to compare propagation delay and power dissipation.
2：Sample Selection and Data Sources:
Various composite materials (LN-Mg, PDMS-Au, PMMA-Cu) and graphene nanoribbon are analyzed. Parasitic values are calculated based on physical parameters from literature.
3：List of Experimental Equipment and Materials:
HSPICE software is used for simulations. Materials include lithium niobate doped with magnesium, polydimethylsiloxane doped with gold, polymethyl methacrylate doped with copper, and graphene nanoribbon.
4：Experimental Procedures and Operational Workflow:
Parasitics (resistance, inductance, capacitance) are modeled and calculated for different technology nodes (65 nm, 45 nm, 32 nm, 22 nm) and interconnect lengths (100 μm to 1000 μm). Simulations are run in HSPICE to measure propagation delay and power dissipation.
5：Data Analysis Methods:
Quantitative comparison of performance metrics (propagation delay, power dissipation, power delay product) between materials is conducted using simulation results.
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