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oe1(光电查) - 科学论文

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出版时间
  • 2018
研究主题
  • Multi-input and multi-output
  • half adder
  • DEMUX
  • electrostatic and electrothermal actuation
  • MEMS resonators
应用领域
  • Optoelectronic Information Science and Engineering
机构单位
  • King Abdullah University of Science and Technology
120 条数据
?? 中文（中国） ▾

  • [IEEE 2019 International Conference on Microwave and Millimeter Wave Technology (ICMMT) - Guangzhou, China (2019.5.19-2019.5.22)] 2019 International Conference on Microwave and Millimeter Wave Technology (ICMMT) - Design of Substrate Integrated Waveguide Based Filtering Antennas

    摘要： This paper reports the design, fabrication, and characterization of arrays of miniaturized, internally fed, polymer electrospray emitters fabricated with stereolithography. The freeform additive manufacturing process used to make the devices has associated two orders of magnitude reduction in the fabrication cost per device and fabrication time (from thousands of dollars to tens of dollars, and from months to hours, respectively) and a two orders of magnitude reduction in the cost of the manufacturing infrastructure (from millions of dollars to tens of thousands of dollars) compared with a silicon MEMS multiplexed electrospray source. The 3-D printed devices include features not easily attainable with other microfabrication methods, e.g., tapered channels and threaded holes. Through the optimization of the fabrication process 10-mm tall, isolated, straight, solid columns with diameter as small as 300 μm, and 12-mm long, straight tubes with inner diameter as small as 400 μm and wall thickness as small as 150 μm were demonstrated. Arrays with as many as 236 internally fed electrospray emitters (236 emitters in 1 cm2) were made, i.e., a twofold increase in emitter density and a sixfold increase in array size compared with the best reported values from multiplexed, internally fed, electrospray sources made of polymer. The characterization of devices with a different array size suggests a uniform emitter operation.

    关键词： electrospray,Additive manufacturing of MEMS,stereolithography,multiplexed liquid ionizers

    更新于2025-09-23 15:21:01

  • [IEEE 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) - Vancouver, BC, Canada (2020.1.18-2020.1.22)] 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) - Monolithic Integration of Plasmonic Meta-Material Absorber with CMOS-MEMs Infrared Sensor for Responsivity Enhancement and Human Detection Application

    摘要： This study integrates monolithically a metal-insulator-metal-based plasmonic metamaterial absorber (PMA) with a thermoelectric (TE) infrared (IR) sensor using standard TSMC CMOS platform. The proposed design extends the strip-via releasing hole structure in [1] to further integrate MIM absorber with TE IR sensor. Such design exhibits three merits: (1) the line width requirement of MIM absorber is achieved by CMOS process, (2) the absorption peaks of MIM absorbers can be modulated by pattern designs in the epsilon-near-pole region, and (3) the MIM absorbers can be designed to broaden the absorption spectrum of IR sensor. In application, the absorption spectrum of IR sensor is designed within 8-14μm in this study for human detection application. Measurement result demonstrates the integration of MIM absorber and IR sensor can achieve 21% improvement and the measured absorption spectrum matches with simulation.

    关键词： CMOS-MEMS,human detection,thermoelectric infrared sensor,responsivity enhancement,plasmonic metamaterial absorber

    更新于2025-09-23 15:21:01

  • [ASME ASME 2018 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference - Quebec City, Quebec, Canada (Sunday 26 August 2018)] Volume 4: 23rd Design for Manufacturing and the Life Cycle Conference; 12th International Conference on Micro- and Nanosystems - Complex Logic Operations Based on MEMS Resonators

    摘要： Complex logic functions based on micro electromechanical resonators has significant attention. Realization of complex logic functions through cascading micro resonators has been deterred by challenges involved in their interconnections and the large required array of resonators. This paper presents a micro electromechanical system MEMS resonator with multiple input (actuation) and output (detection) that enables the realization of complex logic operations. The devices are based on a compound resonator consisting of an in- plane clamped-guided arch beam that is mechanically coupled from its guided side to two flexure beams and to another T- shaped resonant beam. As examples, we experimentally demonstrate using the device to realize a half adder and a 1:2 DEMUX, based on electrothermal and electrostatic tuning of the arch beam and side resonant beam. The logic operation is frequency modulation. This paper demonstrates that with such compound MEMS resonators, it is possible to build more complex logic functionalities.

    关键词： Multi-input and multi-output,half adder,DEMUX,electrostatic and electrothermal actuation,MEMS resonators

    更新于2025-09-23 15:21:01

  • <i>(Invited)</i> 3D Integration Processes for Advanced Sensor Systems and High-Perfomance RF Components

    摘要： Sensor systems are the key elements of today’s automotive, health care, environmental and Internet-of-Things (IoT) applications. By using MEMS sensors data like physical or electrical parameters in production equipment, gas concentration in the environment or chemical parameters in fluids can be recorded, digitized and transferred for further processing e.g. by means of big data algorithms in a server or cloud environment. For realizing such systems advanced sensors, which are in many cases based on sophisticated nano-technologies have to be combined with standard CMOS devices, which digitize the analogue sensor signals and optimize the overall data acquisition and data transmission. 3D integration processes are most suitable for high performant and reliable integration of sensor functions and electronic processing and simultaneously minimize the footprint, weight and form-factor of the sensor/IC product. 3D integration processes as fine-pitch Trough-Silicon-Vias (TSV) technology and various wafer bond technologies will be introduced in this paper.

    关键词： 3D integration,MEMS sensors,wafer bond technologies,TSV technology,heterogeneous integration

    更新于2025-09-23 15:21:01

  • [Energy, Environment, and Sustainability] Sensors for Automotive and Aerospace Applications || Sensors Used in Flying: A Comprehensive Study

    摘要： The aerospace industry is an ever-growing area where the possibility to explore and achieve next-generation technology has always been a challenge. Passenger safety with power conservation has always been areas of great interest in the global aviation sector. The induction of MEMS (micro-electro-mechanical systems) and other micro- and nanotechnologies have revolutionized the area of sensors. It has helped in drastic improvements in the performance characteristics of the systems such as sensitivity, stability, service life, etc., while reducing the overall size, weight, and power requirements. These systems are now being used aboard aircraft for various speci?c applications such as autopilot systems, navigation systems, etc., which were traditionally controlled manually using mechanical and electrical systems. This chapter aims at discussing traditional ?ight instruments and the recent advancements that have occurred due to use of MEMS. Also, we have discussed AVS (air vehicle systems) which are miniature forms of aircraft used for several speci?c purposes including military operations. The requirement for these vehicles in miniaturized navigation, power and communication systems can only be achieved using MEMS and other micro- and nanotechnologies.

    关键词： AVS,Flight instruments,MEMS,Aerospace engineering,Sensors

    更新于2025-09-23 15:21:01

  • A Novel Topology for Process Variation-Tolerant Piezoelectric Micromachined Ultrasonic Transducers

    摘要： This paper presents a novel architecture for piezoelectric micromachined ultrasonic transducers (PMUT) allowing for a drastic reduction in the impact of process variations on the accuracy of the resonant frequency. At the core of this new topology is a toroidal anchoring technique. Measurement results show that inter- and intra-die resonant frequency standard variations can be reduced from 101 kHz to 23 kHz and from 20 kHz to 5.9 kHz, respectively, by using the method proposed in this paper, showcasing devices fabricated using the PiezoMUMPs commercial fabrication technology. From the 16 chips that have been fabricated, each holding 12 PMUT devices of two different topologies, resonant frequency results are presented and analyzed to assess the effectiveness of the proposed approach. In addition, as a proof of concept, the fabricated PMUT are demonstrated to perform distance ranging measurements.

    关键词： frequency,ranging measurements,variability,process variation,MEMS,PMUT,Piezoelectric ultrasonic transducers,microfabrication

    更新于2025-09-23 15:21:01

  • [ASME ASME 2014 International Mechanical Engineering Congress and Exposition - Montreal, Quebec, Canada (Friday 14 November 2014)] Volume 10: Micro- and Nano-Systems Engineering and Packaging - Effect of Imperfections on Fused Silica Shell Resonators

    摘要： Axisymmetric shell resonators have been attractive candidates for high performance MEMS vibratory gyroscopes because of their high quality factor, low sensitivity to environmental vibrations and electrostatic tuning capability. Fused silica shell resonators made by blow torch molding with high quality factor could perform as high performance MEMS gyroscopes. Despite such advantageous features, the performance of these is limited by geometric imperfections that occur during fabrication. This paper investigates effect of geometric asymmetries such as height and radius imperfections, notch, and mass imbalance in the rim of gyroscopes on the split in the natural frequencies of the n=2 wineglass modes. Numerical simulation shows that perfect fused silica shell has 13929 Hz natural resonance frequencies without any frequency split. Analysis of imperfect shell reveals that frequency split is very sensitive to edge geometric imperfection and mass imbalance in the rim. On the other hand, ??? is not very sensitive to the notch in the rim of shell and height imperfection less than 40????.

    关键词： Frequency Split,Geometric Imperfection,MEMS Gyroscope,Shell Resonators,Mode Matching

    更新于2025-09-23 15:21:01

  • [IEEE 48th European Solid-State Device Research Conference (ESSDERC 2018) - Dresden (2018.9.3-2018.9.6)] 2018 48th European Solid-State Device Research Conference (ESSDERC) - Compact MEMS modeling to design full adder in Capacitive Adiabatic Logic

    摘要： We propose implementation of a 1-bit full adder following Capacitive Adiabatic Logic (CAL) paradigm. Combinational logic functions including AND, OR, and XOR gates are realized by five-terminal comb-drive MEMS elements. By in CAL, we demonstrate the ability of MEMS device to be cascadable. By MEMS compact modeling, we can evaluate the energy dissipation and speed of adding operation. In the presented full adder, 99.6% of the energy transferred to the device is recovered for later use when it operates on 2 kOPS.

    关键词： compact modeling,capacitive adiabatic logic,MEMS,full adder,high-temperature electronics

    更新于2025-09-23 15:21:01

  • [IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - The mechanical simulation of a special biosensor

    摘要： Cantilever-based sensor is kind of the most popular MEMS sensor. In this paper, by taking an example the process of analyzing a transducer is explained, such as building models and performing mathematic operations on result data to get the performance parameters of a cantilever-based sensor. We also state the principle of the cantilever bio-sensor. In the meantime we explain the theory of the operating of cantilever, and a cantilever sensor design guided by mechanical simulation.

    关键词： simulation,ANSYS,biosensor,cantilever,MEMS

    更新于2025-09-23 15:21:01

  • [IEEE 2018 International Conference on Optical MEMS and Nanophotonics (OMN) - Lausanne (2018.7.29-2018.8.2)] 2018 International Conference on Optical MEMS and Nanophotonics (OMN) - Digital Silicon Photonic MEMS Phase-Shifter

    摘要： We report on a 4-bit digital silicon photonic MEMS phase-shifter with sub-microsecond switching time and low power consumption (< 10 uW). The device consists of 4 digitally switched phase-shifting units, which in total enable phase shift from (cid:2)(cid:2)(cid:1)/8 to 15pi/8 in increments of (cid:2)(cid:1)/8.

    关键词： Silicon Photonic MEMS,Adiabatic Coupler,Phase Control,Photonic Integrated Circuit,Optical Switch

    更新于2025-09-23 15:21:01