- 标题
- 摘要
- 关键词
- 实验方案
- 产品
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Chip to chip communication through the photonic integrated circuit: A new paradigm to optical VLSI
摘要： The chip to chip communication pertaining to ultra-low power-based very large integrated device is addressed in this paper using photonic integrated circuits (PIC) where photonic circuits comprise nanoscale based light sources, one-dimensional waveguide, and photodetector. The principle of realization of transportation of signal through PIC relies on a different type of losses including diffraction, reflection, scattering, dispersion, and absorption. Moreover, the operational mechanism deals with the low potential signal of 0.5 V to 1.0 V for said communication. The reason for choosing such low potential is that different works related to industrial research are being operated nowadays to develop an efficient VLSI device.The current research has certain hegemony related to miniaturization size and high efficiency as compared to others. To overall, the present communication shows a new paradigm to optical VLSI for near future application in the field of photonics.
关键词： Photonic integrated circuit,Optical VLSI,low power device
更新于2025-09-11 14:15:04
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Research Towards a Heterogeneously Integrated InGaN Laser on Silicon
摘要： A heterogeneously integrated InGaN laser diode is proposed, wherein InGaN films are vertically stacked on a TiO2 waveguide fabricated on a Si wafer by bonding. The optical transverse mode extends to both the GaN and TiO2 in a hybrid mode, facilitating design and fabrication of an adiabatic taper structure. GaN substrate removal and bonding are also presented and discussed.
关键词： Si photonics,InGaN,heterogeneous integration,photonic integrated circuit
更新于2025-09-11 14:15:04