摘要： Effective heat dissipation needed for traditional light-emitting diodes (LEDs) is somewhat difficult because the heat sources are typically encapsulated in silicone and plastic cavities with low thermal conductivities. This article demonstrates a novel packaging design to direct ink print a high thermal conductivity three-dimensional (3D) kaolin/graphene (rGO) suspension (KGS) cavity on direct plated copper (3DPC) ceramic substrate, which applies to improve high-power LEDs heat dissipation. With the modification with titanate coupling agent (TCA), rGO-TCA facilitates interface compatibility between rGO and geopolymer, which, in turn, eliminates microdefects in matrix. Efficient heat transfer channels formed by the combination of the silicone-free structure and cured KGS cavities on 3DPC LEDs, this benefits overall heat dissipation. At the current of 650 mA, the surface temperature of LEDs is reduced about 20 °C, and the 3DPC module for white LED lighting still maintains a color rendering index of 71.4 and a neutral white color temperature of 5381 K, indicating that this research innovates a new class of packaged structure, simplified process and materials with promising possibility in a variety of semiconductor devices.