研究目的
To improve the thermal characteristics of vertical cavity surface emitting laser (VCSEL) arrays through optimized arrangement.
研究成果
The optimized arrangement of VCSEL arrays results in improved thermal characteristics, with maximum temperature increments in the active regions decreasing by at least 1.73% and at most 6.41%. The optimized arrays exhibit more uniform temperature distributions and lower maximum temperatures, especially at higher current densities. Experimental results confirm improved threshold current and slope efficiency for optimized arrays.
研究不足
The study assumes thermal crosstalk occurs only in non-etched areas and treats a single VCSEL as a point heat source, which may not fully capture the complexity of thermal interactions in densely packed arrays. The simulation simplifies the VCSEL structure into eight layers, potentially overlooking detailed thermal effects in more complex structures.
1：Experimental Design and Method Selection:
The study employs a self-organizing algorithm based on the principle of minimum potential energy for optimizing the arrangement of VCSEL arrays. A thermoelectric model using the finite element method (FEM) is used for simulation.
2：Sample Selection and Data Sources:
The study focuses on 808-nm VCSEL arrays with different arrangements (square, hexagonal, circular) fabricated on the same wafer.
3：List of Experimental Equipment and Materials:
The fabrication involves inductively coupled plasma (ICP) etching, wet-oxidation for oxide-apertures, plasma enhanced chemical vapor deposition (PECVD) for SiO2 deposition, and sputtering for contact preparation.
4：Experimental Procedures and Operational Workflow:
The main steps include mesa etching, oxide-aperture preparation, SiO2 deposition and etching, contact preparation, substrate thinning, and bonding to a Cu heat sink.
5：Data Analysis Methods:
The thermal and electrical characteristics are analyzed using a commercial software package COMSOL based on FEM. Output characteristics are studied using VCSEL rate equations.
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