研究目的
Investigating the use of atomic layer deposition for thin film encapsulation to protect OLEDs from moisture and oxygen erosion.
研究成果
ALD-based TFE has emerged as a powerful method to solve existing issues in OLED encapsulation, including pinholes, crystallization, cracks, and overheating. The review highlights the potential of ALD for future flexible and stretchable displays but notes remaining challenges in process optimization and material development.
研究不足
The review identifies challenges such as the need for low-temperature processes compatible with polymer substrates, the limitation of substrate size and low deposition rate, and the difficulty in achieving high accuracy of linewidth resolution on the edge area.
1：Experimental Design and Method Selection:
The review discusses various ALD-based approaches including monolayer films, composite structures, and inorganic nanolaminates to address specific problems like pinholes, crystallization, and cracks in barrier layers.
2：Sample Selection and Data Sources:
The study reviews existing research on ALD-based TFE for OLEDs, including materials like Al2O3, ZrO2, and TiO
3：List of Experimental Equipment and Materials:
ALD reactors and processes are reviewed, including commercial systems from Picosun, Beneq, and Veeco.
4：Experimental Procedures and Operational Workflow:
The review outlines the deposition processes for different materials and structures, including optimization of process parameters like temperature and oxidant precursors.
5：Data Analysis Methods:
The review summarizes the barrier properties of different encapsulation structures, including water vapor transmission rates (WVTR).
独家科研数据包，助您复现前沿成果，加速创新突破
获取完整内容
