研究目的
To demonstrate robust terahertz topological valley transport for on-chip communication, overcoming the limitations of conventional terahertz waveguiding approaches that are sensitive to defects and sharp bends.
研究成果
The study successfully demonstrates robust photonic transport in low-loss silicon chips using the valley Hall topological phase of THz waves, showcasing the potential of topological valley kink states as excellent information carriers for THz communication. This opens new avenues for terabit-per-second datalinks in future technologies.
研究不足
The current system's maximum data transfer rate is limited by the effective bandwidth of the VPC waveguide and the modulation scheme used. Further enhancements could be achieved with advanced modulation techniques and broader VPC bandwidths.
1:Experimental Design and Method Selection:
The study leverages the topological phase of light to design and fabricate all-silicon chip-based terahertz valley photonic crystals (VPCs) for robust waveguiding.
2:Sample Selection and Data Sources:
High-resistivity silicon chips are used to fabricate VPCs with specific geometric configurations to achieve topological valley transport.
3:List of Experimental Equipment and Materials:
The setup includes a continuous-wave THz spectrometer, WR-3 hollow waveguide, and silicon chips with fabricated VPCs.
4:Experimental Procedures and Operational Workflow:
Transmission measurements are conducted to evaluate the robustness of topological kink states through twisted domain walls.
5:Data Analysis Methods:
The performance of the VPCs is analyzed in terms of transmission efficiency and data transfer rates, including error-free communication and real-time video transmission.
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