研究目的
To present a new method for detecting in-plane displacements in MEMS with sub-?ngstr?m accuracy using a curve-fitting method on the intensity profile of images captured with a CCD camera on an optical microscope.
研究成果
The study achieved an in-plane displacement resolution of 0.6 ? by fitting a shifted spline function through the intensity profile of a silicon beam imaged with an optical microscope and a CCD camera. The resolution depends on the signal-to-noise ratio of the image, with photon shot noise being the limiting factor. The technique offers high resolution and can measure instantaneous 'jerky' motions of MEMS structures.
研究不足
The resolution is limited by photon shot noise, which can be controlled but not eliminated. The technique requires careful control of light conditions and may be affected by the optical contrast of the sample.
1：Experimental Design and Method Selection:
The study employs a curve-fitting method to detect in-plane displacements in MEMS devices. The method involves fitting a function to the intensity profile of images captured with a CCD camera on an optical microscope.
2：Sample Selection and Data Sources:
Three different MEMS actuators are used: a nano-ram adhesion sensor comb drive, a 'Leiden MEMS tribometer', and a nitrogen-incorporated ultrananocrystalline diamond (N-UNCD) based adhesion sensor.
3：List of Experimental Equipment and Materials:
Motic PSM-1000 optical microscope with a Motic ULWD50x objective and an additional 2× magnifier lens, Motic MLC150C halogen cold light source, Apogee Alta F4000 interline-scan CCD camera.
4：Experimental Procedures and Operational Workflow:
The devices are placed under the microscope, illuminated through the objective, and images are captured. The intensity profiles are analyzed to detect displacements.
5：Data Analysis Methods:
The position of the actuated beam is calculated by fitting splines for the moving peak and the reference peak separately and determining the shift parameters.
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