研究目的
To review the key solutions to the technical difficulties of the full-colour micro-LED display, focusing on growth technique, transfer printing technique and colour conversion technique.
研究成果
The review concludes that while micro-LED displays offer significant advantages over LCD and OLED displays, challenges remain in material control, integration, and efficiency. The growth, transfer printing, and colour conversion techniques each have potential but require further development to overcome current limitations and achieve commercialization.
研究不足
The paper discusses technical and application constraints such as the effect of size reduction on performance, challenges in high-density integration, repair technique and yield improvement, and the stability and efficiency of colour conversion materials.
The paper reviews various techniques for achieving full-colour micro-LED displays, including growth techniques (nanowire LED, core-shell nanowire LED, multicolour QWs micro-LED, nanoring LED by etching), transfer printing techniques (PDMS stamp pick & place, laser selective-release, electrostatic pick-up transfer, electromagnetic pick-up transfer, fluidic transfer), and colour conversion techniques (printing technique, UV self-aligned curing technique, liquid-capillary force transferring technique). Each technique is analyzed for its methodology, advantages, and challenges.
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PDMS stamp
Used in transfer printing techniques for picking up and placing micro-LEDs.
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MOCVD
Metal-organic chemical vapour deposition used for epitaxial growth of micro-LEDs.
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ICP
Inductively coupled plasma used for etching processes in micro-LED fabrication.
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PECVD
Plasma-enhanced chemical vapour deposition used for depositing passivation layers.
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ITO
Indium tin oxide used as a current spreading layer in micro-LEDs.
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QDs
Quantum dots used for colour conversion in micro-LED displays.
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DBR layer
Distributed Bragg reflector layer used to reflect leaked UV photons to the QDs layer.
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LLO technique
Laser lift-off technique used for substrate removal in micro-LED fabrication.
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Electrostatic transfer head
Used in electrostatic pick-up transfer technique for picking up and placing micro-LEDs.
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Fluidic suspension
Used in fluidic transfer techniques for assembling micro-LEDs.
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