研究目的
To develop Laser-Assisted Bonding with Compression (LABC) technology with NCF to achieve productivity and process reliability simultaneously for 3D IC integration.
研究成果
The LABC technology with NCF was successfully developed and validated for bonding 780μm-thick daisy chain top and bottom chips with a minimum pitch of 30μm and about 27,000 bumps. Laser irradiation time longer than 2 seconds was necessary for good solder joints.
研究不足
The laser irradiation time shorter than 2 seconds was not sufficient to achieve good joints between the top and bottom chips.
1：Experimental Design and Method Selection:
The LABC process with NCF was designed to enhance productivity and simplify the bonding process. A quartz block was used as a bonding head due to its transparency to IR.
2：Sample Selection and Data Sources:
Daisy chain test vehicles with a minimal bump pitch of 30μm and about 27,000 bumps per test vehicle were prepared.
3：List of Experimental Equipment and Materials:
A quartz block, laser as a heat source, and newly developed NCF were used.
4：Experimental Procedures and Operational Workflow:
The bonding process involved laser irradiation with varying powers and times to measure temperature variations and assess joint quality.
5：Data Analysis Methods:
Temperature variations were measured with thermocouples, and joint quality was assessed through SEM images.
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