研究目的
Investigating the impact of annealing on the interface properties of sprayed Al2O3-based MIS structures for silicon surface passivation.
研究成果
The study demonstrates that ultrasonic spray deposition of Al2O3 films followed by appropriate annealing processes can effectively passivate silicon surfaces, with thinner films and lower molar concentrations yielding better results. The findings are promising for applications in silicon solar cell technology.
研究不足
The study focuses on the interface properties of Al2O3/Si and does not explore the bulk properties of Al2O3 films. The impact of other deposition methods or annealing conditions is not investigated.
1:Experimental Design and Method Selection:
Ultrasonic spray method was used to deposit Al2O3 films on quartz and silicon substrates. The films were annealed using two processes: post-deposition annealing (PDA) and post-metallization annealing (PMA).
2:Sample Selection and Data Sources:
p-type Si (100) wafers and quartz slides were used as substrates. Optical, morphological, and electrical properties were investigated.
3:List of Experimental Equipment and Materials:
Spectroscopic Ellipsometer (Semilab GES-5E), UV–Vis–NIR spectrophotometer (Varian Cary 500), Atomic force microscope system (PHYWE Compact), VMP3 potentiostat model, WCT-120 Sinton Instruments system.
4:Experimental Procedures and Operational Workflow:
Films were deposited at 380°C, annealed at 450°C in forming gas (N2/H2) for 30 min. Electrical measurements were carried out on Al/Al2O3/Si (MIS) structures.
5:Data Analysis Methods:
Capacitance–voltage (C–V) and conductance–voltage (G–V) measurements were used to determine effective charge density (Qeff) and interface trap density (Dit).
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