研究目的
Investigating the stretchability and compressibility of a novel bended wrinkle structure for layout design in flexible electronics.
研究成果
The bended wrinkle design for flexible electronics provides high stretchability (up to 309%) and compressibility, with larger pre-strains, bigger initial lengths, and smaller substrate/film thickness ratios contributing to greater stretchability. The design offers important guidelines for future applications in flexible electronics.
研究不足
The study is limited by the material properties of Si and PDMS, the thickness ratio of the substrate to the film, and the pre-strain applied to the substrate. The maximum allowable pre-strain to avoid fracture is 37%.
1:Experimental Design and Method Selection:
The study involves theoretical analyses and finite element method (FEM) to validate the stretchability and compressibility of the bended wrinkle structure.
2:Sample Selection and Data Sources:
A Si thin film and a PDMS substrate are used, with specific elastic properties.
3:List of Experimental Equipment and Materials:
FEM was carried out in Ansys
4:0 with element type Solid95 for the substrate and Shell91 for the top film. Experimental Procedures and Operational Workflow:
Modal analyses were conducted for the film/substrate system, and the first eigenmode was used to update the computational model with initial geometrical imperfection.
5:Data Analysis Methods:
The stretchability and compressibility are analyzed based on theoretical models and FEM results.
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