研究目的
Examining the factors contributing to the accelerated adoption of SiC devices in power electronics.
研究成果
The long wait for SiC to reach a tipping point appears to be nearing its end. This is due to steady progress on every front needed to realize large scale adoption, from the maturation of 6-inch SiC material and a deep understanding of SiC defects, to improved, easy to use devices with a growing reliability track record.