研究目的
To propose a fabricated non-volatile memristor device for neuromorphic computing applications based on Ag/TiO2 NPs/TiO2 TF/Si layers’ structure that achieves better conductivity and storage capacity.
研究成果
The fabricated n-Si/TiO2 TF/TiO2 NPs/Ag based memristor device shows promising results for neuromorphic computing applications, with improved conductivity and storage capacity. The device's performance is attributed to the crystalline nature of TiO2 NPs and the amorphous nature of TiO2 TF, as well as the effective charge trapping within the junction.
研究不足
The interfacial layer under negative voltage-sweeping region is not stable, indicating potential limitations in device stability and performance under certain conditions.
1:Experimental Design and Method Selection:
The fabrication of the memristor device involves the deposition of TiO2 thin film (TF) and TiO2 nanoparticles (NPs) on an n-type Si substrate using electron beam evaporation and glancing angle deposition technique (GLAD), respectively, followed by the evaporation of Ag top electrode.
2:Sample Selection and Data Sources:
n-type Silicon (Si) substrate is used, cleaned with RCA-1 cleaning procedure.
3:List of Experimental Equipment and Materials:
Electron beam evaporator, tube furnace (GSL-1700X, MTI, USA), FEGSEM, EDX, photoluminescence, Raman, and X-ray diffraction equipment.
4:Experimental Procedures and Operational Workflow:
Deposition of TiO2 TF and NPs, annealing, Ag electrode evaporation, and characterization using FEGSEM, EDX, PL, Raman, and XRD.
5:Data Analysis Methods:
Analysis of surface morphology, element mapping, crystalline nature, and electrical characteristics including I-V and C-V measurements.
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Agilent E4980A LCR meter
E4980A
Agilent
Measurement of capacitance-voltage characteristic of the memory device.
E4980A/E4980AL Precision LCR Meter
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Electron beam evaporator
Deposition of TiO2 thin film (TF) on an n-type Si substrate.
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Tube furnace
GSL-1700X
MTI
Annealing of samples in open air condition.
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Field Emission Gun-Scanning Electron Microscopes
FEGSEM
Analysis of the sample's surface morphology.
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Energy-Dispersive X-ray Analysis
EDX
Element mapping of the sample.
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