研究目的
To study and improve the fabrication process of micro-scale magnetometers, focusing on reducing time consumption and increasing reliability through the combination of surface micromachining and flip-chip bonding techniques.
研究成果
The study demonstrates that combining surface micromachining with flip-chip bonding can reduce the number of fabrication steps and time, improving the efficiency and reliability of micro magnetometer production. Future research should focus on optimizing the flip-chip bonding process and utilizing cleanrooms for fabrication.
研究不足
The flip-chip bonding approach is not yet the optimum process and requires further investigation and studies for improvement. Cleanroom utilization is suggested for better contamination control.
1:Experimental Design and Method Selection:
The study compares conventional surface micromachining with a novel approach combining surface micromachining and flip-chip bonding.
2:Sample Selection and Data Sources:
A micro-scale search coil magnetometer with specific dimensions is designed.
3:List of Experimental Equipment and Materials:
Silicon substrate, Physical Vapor Deposition (PVD) machine, aluminum, photoresist, developer solution, DI water, acetone.
4:Experimental Procedures and Operational Workflow:
Detailed steps include substrate preparation, metal deposition, photoresist application, pattern exposure, development, etching, and flip-chip bonding.
5:Data Analysis Methods:
Comparison of fabrication steps and time between the two methods.
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