研究目的
To investigate the dielectric, thermal, and mechanical properties of epoxy and hollow ceramic spheres composites for potential applications in electrical insulation.
研究成果
The study successfully demonstrated that epoxy/hollow ceramic spheres composites exhibit improved thermal conductivity, dielectric properties, and compressive strength compared to pure epoxy resin. These composites are promising candidates for insulating support pieces in electrical applications due to their lightweight and enhanced properties.
研究不足
The study focuses on two specific types of hollow ceramic spheres and their composites with epoxy resin. The scalability of the fabrication process and the performance of the composites under varying environmental conditions were not explored.
1:Experimental Design and Method Selection:
The study involved the preparation of hollow ceramic spheres through a fluidized reactor and their incorporation into epoxy resin to form composites. The properties of these composites were then characterized.
2:Sample Selection and Data Sources:
Two types of hollow ceramic spheres were fabricated from bauxite raw materials, differing in their component ratios. These were used to prepare two types of composites, Epoxy-A and Epoxy-S.
3:List of Experimental Equipment and Materials:
Materials included bauxite raw material, epoxy resin (DGEBA, EPON-828), silane coupling agent (KH-560), and various chemicals for processing. Equipment included a fluidized reactor, optical microscope, heat diffusion system, broadband dielectric spectrometer, compressive testing machine, and thermogravimetric analyzer.
4:Experimental Procedures and Operational Workflow:
The process involved grinding bauxite materials, preparing slurry, coating floating beads, calcinating to form hollow spheres, modifying sphere surfaces, mixing with epoxy resin, and curing to form composites. Characterization included thermal conductivity, dielectric properties, and compressive strength measurements.
5:Data Analysis Methods:
Thermal conductivity was calculated from thermal diffusivity, specific heat, and bulk density. Dielectric properties were measured across a frequency range. Compressive strength was calculated from breaking force and sample dimensions.
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Optical microscope
Leica M125
Leica
Used to observe the inner structure of the composites.
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Bisphenol-A epoxy resin
DGEBA, EPON-828
Used as organic matrix in the composites.
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γ-(2,3-epoxypropoxy) propytrimethoxysilane
KH-560
Shanghai Macklin Biochemical Co., Ltd.
Silane coupling agent used to modify the surfaces of the hollow ceramic spheres.
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Heat diffusion system
NETZSCH, LPA467
NETZSCH
Used to carry out heat transmission tests.
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Broadband dielectric spectrometer
Concept 80
Used to measure dielectric parameters.
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Compressive testing machine
Shanghai Hualong Co.Ltd.
Used to measure the compressive strength of the composites.
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Thermogravimetric analyzer
METTLER TOLEDO
METTLER TOLEDO
Used to measure the thermal stability of the composites.
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