研究目的
To propose and demonstrate a data exchange device based on mode-division multiplexing (MDM) technology capable of exchanging data information between a fundamental mode (TE0) signal and an arbitrary high-order mode (TEx) signal.
研究成果
The proposed on-chip mode exchange device utilizing MRRs is capable of exchanging data information between a TE0 mode signal and a TEx mode signal. The device demonstrated clear and open eye diagrams at 10 Gb/s, with an insertion loss of about 7.5 dB and an extinction ratio of more than 20 dB within the C band. The device's scalability, compact size, and low power consumption make it suitable for future on-chip MDM networks.
研究不足
The mode crosstalk for TE0-to-TE1 mode conversion is less than -16 dB, which could be improved. The device's scalability and compatibility with WDM systems are mentioned as areas for future optimization.
1：Experimental Design and Method Selection:
The experiment involves designing and fabricating a TE0-TE1 mode exchange device using a single microring resonator (MRR) on a silicon-on-insulator (SOI) substrate. The device includes a taper multimode waveguide, a microring waveguide, and a fundamental mode feedback waveguide.
2：Sample Selection and Data Sources:
The device is fabricated on a SOI substrate with 220 nm top silicon on 3 μm buried oxide. The waveguides are patterned by 248 nm deep ultraviolet lithography and inductively coupled plasma etching (ICP).
3：List of Experimental Equipment and Materials:
SOI substrate, deep ultraviolet lithography equipment, ICP etching equipment, TiN heater for tuning the resonant wavelength of MRR.
4：Experimental Procedures and Operational Workflow:
The device's static and dynamic characteristics are measured using an amplified spontaneous emission source (ASE), tunable voltage source (TVS), optical spectrum analyzer (OSA), and digital communication analyzer (DCA).
5：Data Analysis Methods:
The transmission spectra are normalized with a fiber-to-fiber structure to eliminate the effect of light source. The insertion loss, extinction ratio, and mode crosstalk are measured and analyzed.
独家科研数据包，助您复现前沿成果，加速创新突破
获取完整内容-
microring resonator
Used for mode exchange between TE0 and TE1 modes.
-
TiN heater
Integrated on the top of each microring to tune the resonant wavelength of MRR through the thermal-optic effect.
-
SOI substrate
Substrate for fabricating the device.
-
deep ultraviolet lithography equipment
Used for patterning the waveguides.
-
inductively coupled plasma etching equipment
ICP
Used to form the structure of the device.
-
amplified spontaneous emission source
ASE
Used for static characterization of the device.
-
tunable voltage source
TVS
Used for static characterization of the device.
-
optical spectrum analyzer
OSA
Used for static characterization of the device.
-
digital communication analyzer
DCA
Used for dynamic measurement of the device.
-
bit pattern generator
BPG
Generates a 10 Gb/s 231-1 pseudo-random bit sequence for dynamic measurement.
-
tunable laser
TL
Launches monochromatic continuous light-wave for dynamic measurement.
-
LiNbO3 optical modulator
OM
Modulates the light-wave for dynamic measurement.
-
erbium-doped fiber amplifier
EDFA
Amplifies the output signal from the device for dynamic measurement.
-
optical tunable filter
OTF
Filters out the unrequired wavelength for dynamic measurement.
-
登录查看剩余12件设备及参数对照表
查看全部
