1：Experimental Design and Method Selection:

The study used a multi-magnetron sputtering system with pulsed-DC power supplies and pulse width modulation (PWM) to control the sputtering process for Cu and Ti targets. The goal was to achieve a specific elemental ratio in the thin films.

2：Sample Selection and Data Sources:

Thin films were deposited on silicon and silica glass substrates. Elemental composition was analyzed using EDS, structural properties with XRD and TEM, and mechanical properties with nanoindentation.

3：List of Experimental Equipment and Materials:

Equipment includes a four-magnetron sputtering system, MSS type Dora Power System power supplies, optical emission spectrometer (PlasCalc from Micropack), FESEM FEI Nova NanoSEM 230 with EDS, Taylor Hobson CCI Lite optical profiler, CSM Instruments nanoindenter, Siemens 5005 XRD diffractometer, and Philips CM20 SuperTwin TEM. Materials include Cu (99.99%) and Ti (99.995%) targets from Kurt Lesker Co., argon gas, and substrates.

4：99%) and Ti (995%) targets from Kurt Lesker Co., argon gas, and substrates. Experimental Procedures and Operational Workflow:

4. Experimental Procedures and Operational Workflow: The vacuum chamber was evacuated to base pressure, substrates were placed, argon gas was introduced, and sputtering was performed with controlled PWM coefficients. Deposition time was varied, and films were analyzed post-deposition for composition, structure, and properties.

5：Data Analysis Methods:

Elemental composition was quantified using EDS with ZAF model, structural analysis used XRD with Scherrer's equation and TEM with SAED, mechanical properties were calculated using Oliver and Pharr method from nanoindentation data, and surface roughness was measured with optical profiler.