研究目的
To achieve technology scaling in printed transistor density and enhance device performance through three-dimensional monolithic integration of flexible printed organic transistors.
研究成果
The 3D monolithic integration strategy successfully enhances printed transistor density and performance, achieving high yield, uniformity, and stability. It enables scalable fabrication of flexible digital circuits, with potential applications in wearable electronics and IoT. Future work could optimize materials and processes for higher integration and improved reliability.
研究不足
The printing resolution is limited to 10-100 μm, restricting further miniaturization. Performance degradation occurs under high thermal stress (150°C) and long-term storage shows some parameter shifts. Contact resistance issues, especially in n-type transistors, affect mobility extraction.
1:Experimental Design and Method Selection:
The study employs a 3D monolithic integration approach using inkjet and dispenser printing to fabricate dual-gate organic transistors on flexible plastic substrates. The design includes vertical stacking of complementary transistors with shared gate electrodes to increase density and performance.
2:Sample Selection and Data Sources:
Devices are fabricated on 125 μm-thick polyethylene naphthalate (PEN) films. Materials include organic semiconductors (n-type TU-3 and p-type DTBDT-C6), Ag-nanoparticle ink, Parylene dielectrics, and fluoropolymer banks.
3:List of Experimental Equipment and Materials:
Inkjet printer (DMP 2831, Fujifilm Dimatix), dispenser for printing, chemical vapor deposition for Parylene, semiconductor parameter analyzer (Keithley 4200-SCS), oscilloscope (Tektronix DPO2024B), stylus profiler (Bruker Dektak XT), LCR meter (NF Corporation ZM2376).
4:6). Experimental Procedures and Operational Workflow:
4. Experimental Procedures and Operational Workflow: Sequential printing of metal layers, deposition of dielectric layers, printing of semiconductor inks within hydrophobic banks, thermal annealing, and electrical characterization. Steps include inkjet printing of electrodes, CVD of Parylene, SAM treatment for work function modification, and interconnection via laser-drilled vias.
5:Data Analysis Methods:
Electrical characteristics are measured using semiconductor parameter analyzers. Carrier mobilities are extracted from saturation regime transfer characteristics. Statistical analysis includes standard deviations for uniformity assessment.
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Semiconductor Parameter Analyzer
4200-SCS
Keithley
Measurement of static electrical characteristics of printed devices.
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Oscilloscope
DPO2024B
Tektronix
Measurement of dynamic operations, such as ring oscillator output.
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Stylus Profiler
Dektak XT
Bruker
Measurement of film thicknesses and roughness.
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Parylene
diX-SR
KISCO Ltd.
Conformal deposition as dielectric layers for insulation.
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Inkjet Printer
DMP 2831
Fujifilm Dimatix
Printing of Ag-nanoparticle electrodes for source/drain, gate, and interconnection layers.
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LCR Meter
ZM2376
NF Corporation
Measurement of dielectric constant at low frequency.
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Ag-nanoparticle Ink
Nanopaste NPS-JL
Harima Chemicals, Inc.
Used as conductive metal ink for printing electrodes.
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Teonex PEN
DuPont
Flexible plastic substrate for device fabrication.
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Teflon AF1600
DuPont
Hydrophobic fluoropolymer for surface energy modification and bank formation.
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