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Design, fabrication, and characterization of a high-performance CMOS-compatible thermopile infrared detector with self-test function
摘要： This paper presents the design, fabrication and characterization of a CMOS-compatible thermopile infrared (IR) detector with self-test function based on XeF2 front-side dry etching. In order to achieve better performance, a heavily doped N/P-polysilicon is utilized to form thermocouples, and XeF2 front-side isotropic etching is adopted to release and thermal isolation. At the same time, a platinum thermopile IR detector. IR radiation sensing shows that the detector achieves relatively high responsivity of 160.03 V/W and detectivity of 9.75×107 cm?Hz1/2 and a extremely short response time of 2.5 ms in air at room temperature. In addition, self-test measurement is conducted and validated by applying a voltage to the heater. Compared with traditional methods for detecting thermopile performance, this method has obvious convenience and simplicity, which provides a effective way for performance monitoring of thermal-based devices.
关键词： high-performance,thermopile infrared detector,heater,self-test
更新于2025-09-23 15:21:01
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[IEEE 2019 International Conference on Optical MEMS and Nanophotonics (OMN) - Daejeon, Korea (South) (2019.7.28-2019.8.1)] 2019 International Conference on Optical MEMS and Nanophotonics (OMN) - Integration of Thermopile on a Mid IR Waveguide
摘要： We report integration of infrared (IR) thermopile sensor with Mid-IR waveguides via flip-chip bonding technology. A photonic device with input and output grating couplers designed at 3.72um are fabricated on silicon-on-insulator (SOI) platform and integrated with a bare thermopile chip on its output side to realize integrated photonic platform for a myriad range of sensing applications.
关键词： Waveguides,Silicon Photonics,Integrated Photonics,Thermopile
更新于2025-09-16 10:30:52
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Modelling and infrared radiation compensation for non-contact temperature measurement
摘要： Beyond the conventional non-contact temperature compensation and our previous work of multi-sensors compensation, two compensation schemes are proposed and compared. An infrared radiation measurement module with several temperature sensors are built and calibrated with ambient compensation to investigate the dynamic temperature distribution under moving of module from one place to another. The new approach we proposed including the infrared radiation exchanges model between the target, sensor and the optical path thorough temperature monitoring and two fast temperature measurement schemes with dynamic compensation. After careful calibrations and verification of several experiment conditions, our models of two dynamic compensation schemes both show an excellent agreement with the measuring data. The experimental data of compensation scheme reach a stable reading value of target temperature down from 40 min to 2 min for the differential scheme compensation and 6 min for multi-sensors scheme compensation with temperature error around 0.2 °C.
关键词： dynamic compensation schemes,thermopile sensor,non-contact temperature measurement,infrared radiation compensation
更新于2025-09-10 09:29:36
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[IEEE 2018 IEEE International Conference on Electro/Information Technology (EIT) - Rochester, MI, USA (2018.5.3-2018.5.5)] 2018 IEEE International Conference on Electro/Information Technology (EIT) - Activity Recognition Based on Thermopile Imaging Array Sensor
摘要： In this paper, a low resolution infrared array sensor is used to develop an activity recognition system for elderly people. The sensor is composed of a 32x32 thermopile array with the corresponding 33° × 33° field of view. The outputs of the sensor are sequential images in which each pixel contains a temperature value. According to the thermopile images, the activity recognition system first determines whether the target is within the tracking area; if the target is within the tracking area, the location of the target will be detected and three kinds of activities will be identified.
关键词： activity recognition,thermopile imaging array sensor,fall detection
更新于2025-09-10 09:29:36
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Performance enhance of CMOS-MEMS thermoelectric infrared sensor by using sensing material and structure design
摘要： This study presents the micro thermoelectric infrared sensor consisted of the heat material. Experiment results indicate the Detectivity of proposed design is 2-2.6 fold higher The proposed infrared absorber design has an umbrella-like structure with a post anchor to the TSMC 0.18μm 1P6M standard CMOS process and the in-house post-CMOS MEMS process. (infrared sensor consisted of only the serpentine structure with embedded thermocouple), a transduction absorber and the serpentine structure with embedded thermocouple using the serpentine suspension with embedded thermocouple. As compare with the reference design much higher Seebeck coefficient (56-fold), and is employed in this study as the thermocouple junctions is increased. Moreover, the umbrella-like structure has higher infrared absorption area with and without Silicide are respectively characterized. The poly-Si with no Silicide has a as compare with the serpentine structure. In addition, the Seebeck coefficients of poly-Si films better heat-flow path is achieved and the temperature difference between the hot and cold than that of the reference one at 200mtorr. Experiment also show that the responsivity enhancement of proposed design is further increased as the sensor size is reduced in area.
关键词： thermoelectric,Seebeck effect,thermopile,CMOS-MEMS,infrared sensor
更新于2025-09-09 09:28:46
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A CMOS-Based Thermopile Array Fabricated on a Single SiO2 Membrane
摘要： We present a novel thermopile-based infrared (IR) sensor array fabricated on a single CMOS dielectric membrane, comprising of poly-silicon p+ and n+ elements. Processing of the chip is simplified by fabricating the entire array on a single membrane and by using standard CMOS Al metal layers for thermopile cold junction heatsinking. On a chip area of 1.76 mm × 1.76 mm, with a membrane size of 1.2 mm × 1.2 mm, we fabricated IR sensor arrays with 8 × 8 to 100 × 100 pixels. The 8 × 8 pixel device has <2% thermal crosstalk, a responsivity of 36 V/W and enhanced optical absorption in the 8–14 μm waveband, making it particularly suitable for people presence sensing.
关键词： IR image sensor,presence sensing,thermopile array,MEMS,infrared,CMOS
更新于2025-09-04 15:30:14