研究目的
Investigating the recovery of cycling-induced endurance failed HfOx based memristive devices by utilizing oxygen plasma treatment.
研究成果
The study demonstrates that oxygen plasma treatment can effectively recover cycling-induced endurance failed HfOx based memristive devices by supplying additional oxygen ions. This method provides a viable solution for addressing endurance failure in oxide-based memristive devices.
研究不足
The study focuses on Pt/HfOx/Pt devices and may not be directly applicable to other material systems. The effectiveness of oxygen plasma treatment may vary with different device architectures and materials.
1:Experimental Design and Method Selection:
The study involves the fabrication of Pt/HfOx/Pt memristive devices and the observation of their resistive switching characteristics under cycling. Oxygen plasma treatment is applied to recover the devices from endurance failure.
2:Sample Selection and Data Sources:
The samples are commercial Si/Ti/Pt wafers with a HfOx nano film deposited using the radio-frequency magnetron sputtering technique.
3:List of Experimental Equipment and Materials:
Agilent B1500A semiconductor parameter analyzer for I-V measurements, RF magnetron sputtering for HfOx deposition, and an inductively coupled plasma reactor for oxygen plasma treatment.
4:Experimental Procedures and Operational Workflow:
The devices are subjected to consecutive resistive switching cycles until endurance failure is observed. Oxygen plasma treatment is then applied to recover the devices, and their performance is re-evaluated.
5:Data Analysis Methods:
The evolution of resistance states and switching voltages is analyzed to understand the endurance failure and recovery mechanisms.
独家科研数据包,助您复现前沿成果,加速创新突破
获取完整内容