研究目的
Investigating the integration of electro-optical organic materials in a photonic integrated circuit technology for high-speed modulators with ultra-low energy consumption.
研究成果
The study successfully demonstrates the integration of organic electro-optical materials into a photonic integrated circuit technology, achieving a working photonic device with a measurable electro-optical effect. Future work will focus on reducing electrical resistance and integrating functionalized organic materials into more complex photonic circuits.
研究不足
The integration of organic materials into silicon photonic technologies is challenging due to high process temperatures in standard semiconductor fabrication. The study also notes issues with the uniformity of etching processes and the need for further optimization of electrical connections.
1：Experimental Design and Method Selection:
The study focuses on the hybrid integration of organic electro-optical materials into a silicon photonic integrated circuit technology, utilizing a 0.25 μm SiGe BiCMOS pilotline. The methodology includes the fabrication of slot waveguides and ring resonators for electro-optical applications.
2：25 μm SiGe BiCMOS pilotline. The methodology includes the fabrication of slot waveguides and ring resonators for electro-optical applications.
Sample Selection and Data Sources:
2. Sample Selection and Data Sources: The research uses 200 mm SOI wafers with a 220 nm crystalline silicon device layer. Organic materials, specifically PMMA/DR1, are selected for their electro-optical properties.
3：List of Experimental Equipment and Materials:
Equipment includes a 0.25 μm SiGe BiCMOS pilotline, focused ion beam (FIB) for imaging, secondary electron microscopy (SEM), and reactive ion etching (RIE) for fabrication processes. Materials include SOI wafers, PMMA/DR1 polymer, and aluminum for electrodes.
4：25 μm SiGe BiCMOS pilotline, focused ion beam (FIB) for imaging, secondary electron microscopy (SEM), and reactive ion etching (RIE) for fabrication processes. Materials include SOI wafers, PMMA/DR1 polymer, and aluminum for electrodes.
Experimental Procedures and Operational Workflow:
4. Experimental Procedures and Operational Workflow: The process involves the fabrication of photonic devices, release of slot waveguides, deposition of organic materials via spin coating, and electro-optical characterization.
5：Data Analysis Methods:
The analysis includes optical and electro-optical characterization of the devices, measurement of resonance wavelength shifts, and calculation of the quadratic electro-optical coefficient.
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