研究目的
Investigating the surface morphology and dislocation relationship of InxGa1-xAs/InP heterostructures in positive and negative mismatch systems.
研究成果
The research concludes that negative mismatch in the InxGa1-xAs/InP system has a more severe impact on surface morphology and dislocation density compared to positive mismatch due to increased disorder at the interface and easier movement of dislocations from the substrate. The mechanism of buffer layers in reducing mismatch and dislocation is elucidated, suggesting that positive mismatch conditions are preferable for growing higher-quality epitaxial layers when mismatch is unavoidable.
研究不足
The study is limited to specific In contents and growth conditions; it does not explore the effects of varying growth temperatures or pressures extensively. The use of InP substrates, which are expensive and fragile, may constrain practical applications. The analysis relies on certain assumptions in models for stress and dislocation calculations.
1:Experimental Design and Method Selection:
The study involved growing InxGa1-xAs epitaxial layers on InP(100) substrates with different In contents (x = 0.16, 0.28, 0.53, 0.72, 0.82) using low-pressure metal organic chemical vapor deposition (MOCVD) to investigate the effects of lattice mismatch on surface morphology and dislocation density. Characterization techniques included atomic force microscopy (AFM), scanning electron microscopy (SEM), X-ray diffraction (XRD), transmission electron microscopy (TEM), Raman spectroscopy, and Hall effect measurements.
2:16, 28, 53, 72, 82) using low-pressure metal organic chemical vapor deposition (MOCVD) to investigate the effects of lattice mismatch on surface morphology and dislocation density. Characterization techniques included atomic force microscopy (AFM), scanning electron microscopy (SEM), X-ray diffraction (XRD), transmission electron microscopy (TEM), Raman spectroscopy, and Hall effect measurements. Sample Selection and Data Sources:
2. Sample Selection and Data Sources: Samples were prepared with specific In contents as listed in Table 1, using InP(100) substrates. Data were collected from these samples through various analytical instruments.
3:List of Experimental Equipment and Materials:
Equipment used: MOCVD system (AIXTRON 200/4), AFM (Multimode 8), SEM (EVO-18, Zeiss), XRD (D8 Bruker high-resolution X-ray diffractometer), TEM (JEM-2100F, JEOL), ion polishing system (Leica RES101), Raman spectroscope (UV-Horiba), Hall tester (Lake-7704A). Materials: Trimethylindium (TMIn), trimethylgallium (TMGa), arsine (AsH3) in H2, palladium-diffused hydrogen carrier gas, InP substrates.
4:Experimental Procedures and Operational Workflow:
Epitaxial layers were grown at 530°C with a reactor pressure of 2 × 10^3 Pa and total flow rate of 6650 ml/min. Samples were characterized for morphology (AFM, SEM), crystalline quality (XRD rocking curves), dislocation density (TEM), residual stress (Raman spectroscopy), and electrical properties (Hall effect). Cross-sectional TEM samples were prepared by thinning and ion-milling.
5:Data Analysis Methods:
Dislocation density was calculated from XRD rocking curve full width at half maximum (FWHM) using a specific formula. Residual stress was derived from Raman shift measurements using provided equations. Surface roughness was analyzed from AFM data. Statistical analysis of carrier concentration and other parameters was performed based on experimental measurements.
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MOCVD System
AIXTRON 200/4
AIXTRON
Used for growing InxGa1-xAs epitaxial layers on InP substrates.
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Scanning Electron Microscope
EVO-18
Zeiss
Used to observe the surface topography of samples.
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X-ray Diffractometer
D8 Bruker high-resolution
Bruker
Used to measure full width at half maximum from X-ray rocking curves for crystalline quality analysis.
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Transmission Electron Microscope
JEM-2100F
JEOL
Used for high-resolution imaging to observe dislocations and interface characteristics.
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Ion Polishing System
Leica RES101
Leica
Used to thin samples and make them electron-transparent for TEM observation.
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Atomic Force Microscope
Multimode 8
Used to observe the morphology and measure surface roughness of samples.
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Raman Spectroscope
UV-Horiba
Horiba
Used to measure Raman scattering for residual stress analysis.
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Hall Tester
Lake-7704A
Lake
Used to measure Hall effect for carrier concentration and type determination.
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